Material Processing

Marking and Engraving 

Fiber lasers are well suited for material processing such as parts marking, UID (Unique Identifier) and deep engraving due to their higher efficiencies, smaller spot sizes and smaller footprints than existing YAG and CO2 laser systems. The Ytterbium fiber laser provides the user with a zero-maintenance, highly reliable laser source and thereby provides a lower utility cost.

We at Unilumen are current exploring ares of marking and engraving by developing a complete solution with Pulsed laser to deleiver a turn key marking laser wich can be applied in the marking of wood, ceramics,  sheet metal, circuit markings, electronic chip marking.


The higher efficiency of fiber lasers compared to other laser systems makes it a very attractive option when dealing with large deployments. This is particularly true for the automotive industry where lasers are being used for body part and component welding, offering a potential revenue upside for fiber lasers of $400-$800 million/yr.

At Unilumen, we are amining at replacing the ectronbeam welding with fibre optic laser. The main advatages of perfering a fiber optic laser over other welding measures are because they have high power output, high optical qualtity beams, low maintanence, reliable and more compact.

 Material Processing

Both metal and non-metal cutting will benefit from the introduction of fiber lasers where superior beam quality will bring reduced cutting thresholds, smaller feature size and the potential to address the high end hard tooling market.

At Unilumen, are aiming at high precision cutting of ferros and non-ferros for aerospace applications, where high percison cutting is involved with minimal wastage and minimal   thermal affected zone.

 Silicon Wafer cutting 

Traditionally silicon wafers have been cut with diamond saws, occasionally using a scribe and break process, which have the limitation that they can only cut straight lines and suffer from edge chipping. The fiber laser process is robust, simple, and highly repeatable with a large operating envelope and takes advantage of a number of the intrinsic properties of semiconductor materials. All surface conditions can be cut at similar speeds and therefore, the capital and running costs will be only a small percentage of solid state or water jet based systems.